List of attendees
Workshop on Mixing Logic and DRAM:
Chips that Compute and Remember

Sunday, June 1st, 1997, 8:30am-5:30pm
Denver, Colorado

Organized as part of the 24th Annual
International Symposium on Computer Architecture


Last, FirstAffiliationE-mail
Adve, SaritaRice Universitysarita@rice.edu
Anderson, ThomasUniversity of California - Berkeleytea@cs.berkeley.edu
Babb, JonathanMITjbabb@mit.edu
Baer, Jean-LoupUniversity of Washingtonbaer@cs.washington.edu
Bagherzadeh, NaderUniversity of California, Irvinenader@ece.uci.edu
Barroso, Luiz AndreDIGITAL Western Research Labbarroso@pa.dec.com
Berenbaum, AlanBell Labs, Lucent Technologiesadb@bell-labs.com
Boppana, RajendraUT San Antonioboppana@cs.utsa.edu
Brockman, JayUniversity of Notre Damejbb@cse.nd.edu
Brown, AaronHarvard Universityabrown@eecs.harvard.edu
Burger, DougUniversity of Wisconsin-Madisondburger@cs.wisc.edu
Calder, BradUniversity of California, San Diegocalder@cs.ucsd.edu
Cardwell, NealUniversity of California-Berkeleyneal@cs.berkeley.edu
Choi, Yunhosamsung electronics.coyhchoi@khpost.semi.samsung.com
Chong, FredUniversity of California at Davischong@cs.ucdavis.edu
Dennison, CharlesMicron Technologycdennison@micron.com
Elliott, DuncanUniversity of Albertaduncan.elliott@ualberta.ca
Emberson, DavidSun Microsystemsdre@sun.co
Ertekin, OguzHewlett-Packard Companyoe@fc.hp.com
Fagin, BarryUS Air Force Academyfagin@cs.usafa.af.mil
Falsafi, BabakUniversity of Wisconsin -- Madisonbabak@cs.wisc.edu
Fillo, MarcoDigital Equipment Co.fillo@eng.pko.dec.com
Frank, MatthewM.I.T.mfrank@lcs.mit.edu
Freudenthal, EricNew York Universityfreudenthal@nyu.edu
Fromm, RichUniversity of California, Berkeleyrfromm@cs.berkeley.edu
Gao, GuangUniversity of Delawareggao@cs.mcgill.ca
Gharachorloo, KouroshDigital Equipment Corporationkourosh@pa.dec.com
Giacalone, GlennDigital Equipment Corp.gpg@choosy.blo.dec.com
Golbus, JasonUniversity of California, Berkeleyjgolbus@cs.berkeley.edu
Goodman, JamesUniversity of Wisconsin-Madisongoodman@cs.wisc.edu
Gopal, SridharUniversity of Wisconsin-Madisongsri@cs.wisc.edu
Gottlieb, AllanNYU and NEC Researchgottlieb@nyu.edu
Gribstad, BenUniversity of California, Berkeleygribstad@cory.eecs.berkeley.edu
Gunter, MichialMIPS Group, Silicon Graphicsgunter@sgi.com
Hammond, LanceStanford Universitylance@leland.stanford.edu
Hill, MarkUniversity of Wisconsin - Madisonmarkhill@cs.wisc.edu
Hingarh, HemrajSun Microsystemskaryn.marxmiller@eng.sun.com
Hsu, Wei-ChungHewlett Packard Companywei@cup.hp.com
Hwang, HoyoungSeoul National Universityhyhwang@archi.snu.ac.kr
Ignatowski, MichaelIBMmignatowski@vnet.ibm.com
Iwata, EjiiStanford Universityiwata@uru.stanford.edu
Jiang, DanielM.I.T.xjiang@lcs.mit.edu
Joo, YangsungLG Semicon Co., Ltd.jooys@lgsemicon.co.kr
Joshi, AmodIntel Corporationamjoshi@ichips.intel.com
Kamannavar, AnandUniversity of Wisconsin - Madisonanand@ece.wisc.edu
Kaxiras, StefanosUniversity of Wisconsin-Madisonkaxiras@cs.wisc.edu
Keeton, KimUniversity of California, Berkeleykkeeton@cs.berkeley.edu
Keltcher, PaulHewlett Packardkeltcher@cdc.hp.com
Kim, Lee-SupKAISTeskim@eekaist.kaist.ac.kr
Kissell, KevinSilicon Graphicskevink@acm.org
Kobayashi, SatoruNEC CorporationFWT34641@biglobe.ne.jp
Koppelman, DavidLouisiana State University ECE Deptkoppel@ee.lsu.edu
Koren, YuvalSilicon Graphics, Inc.yuval@sgi.com
Koufaty, DavidUniversity of Illinoiskoufaty@cs.uiuc.edu
Kozyrakis, ChristoforosUniversity of California, Berkeleykozyraki@cs.berkeley.edu
Krishnan, VenkataUniversity of Illinoisvenkat@cs.uiuc.edu
Kubiatowicz, JohnM.I.T.kubitron@lcs.mit.edu
Lai, KonradIntellai@ichips.intel.com
Lalwani, AjaySamsungalalwani@ssi.samsung.com
Landers, RobertTexas Instrumentslanders@ti.com
Lebeck, AlvinDuke Universityalvy@cs.duke.edu
Lee, CorinnaUniversity of Torontocorinna@eecg.toronto.edu
Lee, DennisUniversity of Washingtondlee@cs.washington.edu
Lee, Moon-KeyYon Sei Universityvisprof@uivlsisu.csl.uiuc.edu
Lee, WalterM.I.T.walt@lcs.mit.edu
Lenoski, DanSilicon Graphicslenoski@sgi.com
Lim, Beng-HongIBM Corporationbhlim@watson.ibm.com
Lipman, AaronHarvard Universitylipman@eccs.harvard.edu
Loft, RichardNational Center for Atmospheric Researchloft@ncar.ucar.edu
Mackenzie, KennethM.I.T.kenmac@lcs.mit.edh
Man, RichardHewlett Packard Co.mun@cup.hp.com
Marquez, AndresUniversity of Delawaremarquez@eecis.udel.edu
Martin, MiloUW-Madisonmilo@cs.wisc.edu
Mateo, ValeroUPCmares@ac.upc.es
Merrill, MichaelNSAmhmerri@zombie.ncsc.mil
Michaud, PierreIRISA/INRIApmichaud@irisa.fr
Miyamori, TakashiToshibamiyam0@leland.stanford.edu
Moshovos, AndreasUniversity of Wisconsin-Madisonmoshovos@cs.wisc.edu
Mowry, ToddUniversity of Torontotcm@eecg.toronto.edu
Murakami, KazuakiKyushu Universitymurakami@c.csce.kyushu-u.ac.jp
Nation, WayneIBMnation@vnet.ibm.com
Nettleton, NylesSun Microsystemsnyles@cyberspace.eng.sun.com
Nowatzyk, AndreasDEC-WRLagn@acm.org
Olukotun, KunleStanford Universitykunle@ogun.stanford.edu
Osborne, RandyMitsubishi Electric Research Labosborne@merl.com
Oskin, MarkU.C. Davismhoskin@ucdavis.edu
Padubidri, SanjayIntel Corporationspadubid@ichips.intel.com
Pai, VijayRice Universityvijaypai@ece.rice.edu
Panda, DhabaleswarThe Ohio State Universitypanda@cis.ohio-state.edu
Parkin, MikeSun Microsystemsparkin@eng.sun.com
Patterson, DavidUniversity of California, Berkeleypattrsn@cs.berkeley.edu
Peir, Jih-KwonUniversity of Floridapeir@cise.ufl.edu
Perissakis, SteliosUniversity of California-Berkeleysper@cs.berkeley.edu
Plakal, ManojUniversity of Wisconsin-Madisonplakal@cs.wisc.edu
Postiff, MattUniversity of Michiganpostiffm@umich.edu
Pressel, DanielU.S. Armydmpresse@arl.mil
Przybylski, StevenVerdande Groupsp@verdande.com
Raman, RenuSun Microelectronicsrenu.raman@Eng.Sun.COM
Ranganathan, ParthaRice Universityparthas@rice.edu
Ronen, RonnyIntel Israelronen@iil.intel.com
Sastry, SubramanyaUniversity of Wisconsin, Madisonsastry@cs.wisc.edu
Saxena, RahulIntel Corporationrsaxena@mipos2.intel.com
Schoinas, IoannisUniv. of Wisconsin - Madisonschoinas@cs.wisc.edu
Seznec, AndreIRISA/INRIAseznec@irisa.fr
Sheaffer, GadIntel Corporationgss@ichips.intel.com
Shin, Hyun J.Hyundai Electronics / Memory R&Dhjshin@sr.hei.co.kr
Sladic, DanUniversity of Torontosladic@eecg.toronto.edu
Smith, Michael D.Harvard Universitysmith@eecs.harvard.edu
Stamm, RebeccaDigital Semiconductorrebecca.stamm@h10.mts.dec.com
Steffan, GregUniversity of Torontosteffan@mit.sgi.com
Su, Ching-LongRockwell Semiconductor Systems
Sugumar, RabinSGI/Cray Researchrabin@cray.com
Swanson, MarkUniversity of Utahswanson@cs.utah.edu
Taylor, MichaelM.I.T.mtaylor@lcs.mit.edu
Thomas, RandiUniversity of California Berkeleyrandit@cs.berkeley.edu
Torrellas, JosepUniversity of Illinoistorrella@cs.uiuc.edu
Vijaykumar, T.N.University of Wisconsin-Madisonvijay@cs.wisc.edu
Wang, Wen-HannIntelwang@ichips.intel.com
Weems, CharlesUniversity of Mass.weems@cs.umass.edu
Wicki, ThomasSun Microsystems, Inc.wicki@eng.sun.com
Wilson, Kenneth M.Stanford Universitykwilson@shasta.stanford.edu
Wood, DavidUniversity of Wisconsin - Madisondavid@cs.wisc.edu
Yamauchi, TadaakiMitsubishi Electric Corporationtadaaki1@leland.stanford.edu
Yang, WoodwardHarvard Universitywoody@eecs.harvard.edu
Young, CliffHarvard Universitycyoung@eecs.harvard.edu
Zhai, AntoniaDept. of Electrical and Computer Engineeringzhaia@eecg.toronto.edu
Zilles, CraigU.W. Madison Electrical and Computer Eng.zilles@ece.wisc.edu
Zyuban, VictorUniversity of Notre Damevzyuban@cse.nd.edu


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