List of attendees
Workshop on Mixing Logic and DRAM:
Chips that Compute and Remember

Sunday, June 1st, 1997, 8:30am-5:30pm
Denver, Colorado

Organized as part of the 24th Annual International Symposium on Computer Architecture

Last, First	Affiliation	E-mail
Adve, Sarita	Rice University	sarita@rice.edu
Anderson, Thomas	University of California - Berkeley	tea@cs.berkeley.edu
Babb, Jonathan	MIT	jbabb@mit.edu
Baer, Jean-Loup	University of Washington	baer@cs.washington.edu
Bagherzadeh, Nader	University of California, Irvine	nader@ece.uci.edu
Barroso, Luiz Andre	DIGITAL Western Research Lab	barroso@pa.dec.com
Berenbaum, Alan	Bell Labs, Lucent Technologies	adb@bell-labs.com
Boppana, Rajendra	UT San Antonio	boppana@cs.utsa.edu
Brockman, Jay	University of Notre Dame	jbb@cse.nd.edu
Brown, Aaron	Harvard University	abrown@eecs.harvard.edu
Burger, Doug	University of Wisconsin-Madison	dburger@cs.wisc.edu
Calder, Brad	University of California, San Diego	calder@cs.ucsd.edu
Cardwell, Neal	University of California-Berkeley	neal@cs.berkeley.edu
Choi, Yunho	samsung electronics.co	yhchoi@khpost.semi.samsung.com
Chong, Fred	University of California at Davis	chong@cs.ucdavis.edu
Dennison, Charles	Micron Technology	cdennison@micron.com
Elliott, Duncan	University of Alberta	duncan.elliott@ualberta.ca
Emberson, David	Sun Microsystems	dre@sun.co
Ertekin, Oguz	Hewlett-Packard Company	oe@fc.hp.com
Fagin, Barry	US Air Force Academy	fagin@cs.usafa.af.mil
Falsafi, Babak	University of Wisconsin -- Madison	babak@cs.wisc.edu
Fillo, Marco	Digital Equipment Co.	fillo@eng.pko.dec.com
Frank, Matthew	M.I.T.	mfrank@lcs.mit.edu
Freudenthal, Eric	New York University	freudenthal@nyu.edu
Fromm, Rich	University of California, Berkeley	rfromm@cs.berkeley.edu
Gao, Guang	University of Delaware	ggao@cs.mcgill.ca
Gharachorloo, Kourosh	Digital Equipment Corporation	kourosh@pa.dec.com
Giacalone, Glenn	Digital Equipment Corp.	gpg@choosy.blo.dec.com
Golbus, Jason	University of California, Berkeley	jgolbus@cs.berkeley.edu
Goodman, James	University of Wisconsin-Madison	goodman@cs.wisc.edu
Gopal, Sridhar	University of Wisconsin-Madison	gsri@cs.wisc.edu
Gottlieb, Allan	NYU and NEC Research	gottlieb@nyu.edu
Gribstad, Ben	University of California, Berkeley	gribstad@cory.eecs.berkeley.edu
Gunter, Michial	MIPS Group, Silicon Graphics	gunter@sgi.com
Hammond, Lance	Stanford University	lance@leland.stanford.edu
Hill, Mark	University of Wisconsin - Madison	markhill@cs.wisc.edu
Hingarh, Hemraj	Sun Microsystems	karyn.marxmiller@eng.sun.com
Hsu, Wei-Chung	Hewlett Packard Company	wei@cup.hp.com
Hwang, Hoyoung	Seoul National University	hyhwang@archi.snu.ac.kr
Ignatowski, Michael	IBM	mignatowski@vnet.ibm.com
Iwata, Ejii	Stanford University	iwata@uru.stanford.edu
Jiang, Daniel	M.I.T.	xjiang@lcs.mit.edu
Joo, Yangsung	LG Semicon Co., Ltd.	jooys@lgsemicon.co.kr
Joshi, Amod	Intel Corporation	amjoshi@ichips.intel.com
Kamannavar, Anand	University of Wisconsin - Madison	anand@ece.wisc.edu
Kaxiras, Stefanos	University of Wisconsin-Madison	kaxiras@cs.wisc.edu
Keeton, Kim	University of California, Berkeley	kkeeton@cs.berkeley.edu
Keltcher, Paul	Hewlett Packard	keltcher@cdc.hp.com
Kim, Lee-Sup	KAIST	eskim@eekaist.kaist.ac.kr
Kissell, Kevin	Silicon Graphics	kevink@acm.org
Kobayashi, Satoru	NEC Corporation	FWT34641@biglobe.ne.jp
Koppelman, David	Louisiana State University ECE Dept	koppel@ee.lsu.edu
Koren, Yuval	Silicon Graphics, Inc.	yuval@sgi.com
Koufaty, David	University of Illinois	koufaty@cs.uiuc.edu
Kozyrakis, Christoforos	University of California, Berkeley	kozyraki@cs.berkeley.edu
Krishnan, Venkata	University of Illinois	venkat@cs.uiuc.edu
Kubiatowicz, John	M.I.T.	kubitron@lcs.mit.edu
Lai, Konrad	Intel	lai@ichips.intel.com
Lalwani, Ajay	Samsung	alalwani@ssi.samsung.com
Landers, Robert	Texas Instruments	landers@ti.com
Lebeck, Alvin	Duke University	alvy@cs.duke.edu
Lee, Corinna	University of Toronto	corinna@eecg.toronto.edu
Lee, Dennis	University of Washington	dlee@cs.washington.edu
Lee, Moon-Key	Yon Sei University	visprof@uivlsisu.csl.uiuc.edu
Lee, Walter	M.I.T.	walt@lcs.mit.edu
Lenoski, Dan	Silicon Graphics	lenoski@sgi.com
Lim, Beng-Hong	IBM Corporation	bhlim@watson.ibm.com
Lipman, Aaron	Harvard University	lipman@eccs.harvard.edu
Loft, Richard	National Center for Atmospheric Research	loft@ncar.ucar.edu
Mackenzie, Kenneth	M.I.T.	kenmac@lcs.mit.edh
Man, Richard	Hewlett Packard Co.	mun@cup.hp.com
Marquez, Andres	University of Delaware	marquez@eecis.udel.edu
Martin, Milo	UW-Madison	milo@cs.wisc.edu
Mateo, Valero	UPC	mares@ac.upc.es
Merrill, Michael	NSA	mhmerri@zombie.ncsc.mil
Michaud, Pierre	IRISA/INRIA	pmichaud@irisa.fr
Miyamori, Takashi	Toshiba	miyam0@leland.stanford.edu
Moshovos, Andreas	University of Wisconsin-Madison	moshovos@cs.wisc.edu
Mowry, Todd	University of Toronto	tcm@eecg.toronto.edu
Murakami, Kazuaki	Kyushu University	murakami@c.csce.kyushu-u.ac.jp
Nation, Wayne	IBM	nation@vnet.ibm.com
Nettleton, Nyles	Sun Microsystems	nyles@cyberspace.eng.sun.com
Nowatzyk, Andreas	DEC-WRL	agn@acm.org
Olukotun, Kunle	Stanford University	kunle@ogun.stanford.edu
Osborne, Randy	Mitsubishi Electric Research Lab	osborne@merl.com
Oskin, Mark	U.C. Davis	mhoskin@ucdavis.edu
Padubidri, Sanjay	Intel Corporation	spadubid@ichips.intel.com
Pai, Vijay	Rice University	vijaypai@ece.rice.edu
Panda, Dhabaleswar	The Ohio State University	panda@cis.ohio-state.edu
Parkin, Mike	Sun Microsystems	parkin@eng.sun.com
Patterson, David	University of California, Berkeley	pattrsn@cs.berkeley.edu
Peir, Jih-Kwon	University of Florida	peir@cise.ufl.edu
Perissakis, Stelios	University of California-Berkeley	sper@cs.berkeley.edu
Plakal, Manoj	University of Wisconsin-Madison	plakal@cs.wisc.edu
Postiff, Matt	University of Michigan	postiffm@umich.edu
Pressel, Daniel	U.S. Army	dmpresse@arl.mil
Przybylski, Steven	Verdande Group	sp@verdande.com
Raman, Renu	Sun Microelectronics	renu.raman@Eng.Sun.COM
Ranganathan, Partha	Rice University	parthas@rice.edu
Ronen, Ronny	Intel Israel	ronen@iil.intel.com
Sastry, Subramanya	University of Wisconsin, Madison	sastry@cs.wisc.edu
Saxena, Rahul	Intel Corporation	rsaxena@mipos2.intel.com
Schoinas, Ioannis	Univ. of Wisconsin - Madison	schoinas@cs.wisc.edu
Seznec, Andre	IRISA/INRIA	seznec@irisa.fr
Sheaffer, Gad	Intel Corporation	gss@ichips.intel.com
Shin, Hyun J.	Hyundai Electronics / Memory R&D	hjshin@sr.hei.co.kr
Sladic, Dan	University of Toronto	sladic@eecg.toronto.edu
Smith, Michael D.	Harvard University	smith@eecs.harvard.edu
Stamm, Rebecca	Digital Semiconductor	rebecca.stamm@h10.mts.dec.com
Steffan, Greg	University of Toronto	steffan@mit.sgi.com
Su, Ching-Long	Rockwell Semiconductor Systems
Sugumar, Rabin	SGI/Cray Research	rabin@cray.com
Swanson, Mark	University of Utah	swanson@cs.utah.edu
Taylor, Michael	M.I.T.	mtaylor@lcs.mit.edu
Thomas, Randi	University of California Berkeley	randit@cs.berkeley.edu
Torrellas, Josep	University of Illinois	torrella@cs.uiuc.edu
Vijaykumar, T.N.	University of Wisconsin-Madison	vijay@cs.wisc.edu
Wang, Wen-Hann	Intel	wang@ichips.intel.com
Weems, Charles	University of Mass.	weems@cs.umass.edu
Wicki, Thomas	Sun Microsystems, Inc.	wicki@eng.sun.com
Wilson, Kenneth M.	Stanford University	kwilson@shasta.stanford.edu
Wood, David	University of Wisconsin - Madison	david@cs.wisc.edu
Yamauchi, Tadaaki	Mitsubishi Electric Corporation	tadaaki1@leland.stanford.edu
Yang, Woodward	Harvard University	woody@eecs.harvard.edu
Young, Cliff	Harvard University	cyoung@eecs.harvard.edu
Zhai, Antonia	Dept. of Electrical and Computer Engineering	zhaia@eecg.toronto.edu
Zilles, Craig	U.W. Madison Electrical and Computer Eng.	zilles@ece.wisc.edu
Zyuban, Victor	University of Notre Dame	vzyuban@cse.nd.edu

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